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Lantronix
Lantronix xPico 270 XPC270100B LGA embedded IoT gateway module

Lantronix xPico 270 Wi-Fi Bluetooth LGA Module

Lantronix|

MPN: XPC270100B

|

UPC: 0783384239265

Available on Backorder
$38.10$39.92

Ships from and sold by A5 IT

Available on backorder — ships as soon as stock arrives

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Key Features

  • Dual-band Wi-Fi: IEEE 802.11 a/b/g up to 54 Mbps, 802.11 n (1×1) up to 150 Mbps and 802.11AC up to 433 Mbps
  • Ethernet: IEEE 802.3 MAC with 10Base-T and 100Base-TX (RMII)
  • Bluetooth: Bluetooth Core Specification version 4.2 with BR/EDR/Bluetooth LE
  • Concurrent wireless modes: Concurrent Soft AP + STA (Client), Client and Soft AP
  • Management: Lantronix Percepxion™ cloud-based IoT edge solution, REST, MQTT and Internal Web Server (HTTP/HTTPS)
  • Security: Secure Boot, Secure Firmware-Over-the-Air (FOTA) Updates, Secure Key Storage, Encrypted Configuration, SSL/TLS and HTTPS
  • LGA configuration: 17mm x 25mm x 2mm with Tape and Reel, MSL 3 packaging
  • Dual-band Wi-Fi (802.11 a/b/g/n/ac) and Ethernet
XPC270100B is the LGA, tape-and-reel configuration of the Lantronix xPico 270 Embedded IoT Gateway. It delivers Ethernet, dual-band 802.11ac Wi-Fi and Bluetooth/Bluetooth LE 4.2 connectivity in a 17mm x 25mm x 2mm LGA module. Lantronix positions xPico 270 for OEM smart connected products. It enables operation as a network co-processor or wireless MCU and supports automatic network connection management, Concurrent Soft AP + STA mode and Ethernet to Wi-Fi Client Bridge (Single Host Mode). Security and management are built in. The module supports Secure Boot, Secure Firmware-Over-the-Air (FOTA) Updates, Secure Key Storage, Encrypted Configuration, role-based access control, WPA2 Enterprise and WPA3-Enterprise Transition Mode and WPA3-Personal with firmware v5.0.0.0 or later. Management interfaces include Lantronix Percepxion™, REST, MQTT, Internal Web Server (HTTP/HTTPS), XML Configuration and XML Status.

Ideal For

  • Adding dual-band 802.11AC Wi-Fi, Ethernet and Bluetooth connectivity to OEM smart connected products
  • Using the xPico 270 as a network co-processor for embedded application development
  • Using the module as a wireless MCU with the provided SDK
  • Providing remote device management through Lantronix Percepxion™

Why This Product

  • 1This SKU is the LGA configuration with Tape and Reel, MSL 3 packaging
  • 2The xPico 270 series also lists an Edge Card form factor at 22mm x 35.5mm x 2.73 mm packaged in Tray

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